Senior Product Lead - Advanced Packaging and ...

Senior Product Lead - Advanced Packaging and Semiconductor ElectronicsReady to make your application Please do read through the description at least once before clicking on Apply.Position Overview:We are seeking a Senior Product Lead with deep expertise in Semiconductor Electronics and ASIC Design, particularly in mixed-signal design, chiplet integration, and advanced packaging. This role requires advanced knowledge in BEOL and FEOL semiconductor processing, as well as expertise in current packaging and substrate technologies.Key Responsibilities:Lead product development for advanced semiconductor electronics and ASICs.Drive innovations in mixed-signal and chiplet designs, including high-speed chiplet I/O.Ensure signal and power integrity across all design phases.Collaborate with cross-functional teams to ensure seamless project integration and timely delivery.Mentor junior engineers, fostering innovation and continuous learning.Required Qualifications:Bachelor's or master's degree in electrical engineering, Computer Engineering, or a related field.10+ years of experience in semiconductor electronics and ASIC design.Expertise in mixed-signal and chiplet design, as well as advanced packaging technologies.Strong experience with chiplet integration and high-speed chiplet I/O.Proven track record in maintaining signal integrity and power integrity in complex designs.Preferred Qualifications:Ph.D. in a relevant field.Experience with leading design and simulation tools.Published works or patents in semiconductor technologies.Excellent leadership, communication, and project management skills.Location: On-Site - 5 Days A Week (Santa Clara, CA)Position Type: TemporarySalary: $300k - $400k DOEEducation: Bachelor's or master's degree in electrical engineering, Computer Engineering, or a related field. No 3rd party agencies or C2C Abel Lara | 408.550.2800 x119Abel@

Created: 2025-03-01