Sr. Advanced Packaging Engineer

Senior Advanced Packaging EngineerAlbany, NYAbout UsMenlo Micro has reinvented one of the most fundamental building blocks of electronic systems - the electronic switch. Menlo Micro's technology creates a new switch category that eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worlds with its "Ideal Switch."Are you interested in playing a critical, impactful role and work with top electronic systems talent at an exciting startup backed by industry leaders? Do you want to help create truly disruptive and unique products that will change markets? If you answered yes to both, this may be your opportunity to have a significant impact at a cutting-edge startup with industry-leading technology that will drive electronic systems innovation across a diverse range of industries.Role Summary and PurposeYou will drive the thermal-mechanical design, new package and assembly process development and production package optimization for Menlo Micro's diverse power and RF products that use our innovative MEMS switch technology. In this role you will be the lead engineer ensuring technical attainment of all design and qualification requirements, including characterization and reliability testing, and participate in the timely release-to-production.You will directly impact critical roadmaps and support new technology developments. Projects will encompass design, characterization, packaging, thermal mechanical considerations, assembly, mechanical test strategy, data analysis, reliability testing, root cause problem solving, and material dispositioning.Essential ResponsibilitiesThis is a hands-on role, and key responsibilities include:Device substrate, package, and module design & Design for Manufacturability (DFM) of MEMS-based RF and power switch productsEffective material, process and component design and selection based on thorough thermal, mechanical and stress analysisMechanical design and simulation of microelectronic packages and assembliesPackage technology roadmap definition and execution for modules and packaging aspects of Menlo Micro's product linesAssessment and integration of 3D Heterogeneous packaging strategy3D modeling for Menlo Micro packages, modules and assembliesCharacterization and reliability stress testing of both die, package and module-level productsDesign verification of Coefficient of Thermal Expansion (CTE) thermal impedance, and associated stressesMaterial selection for mechanical parts and attachmentsSolder stress modeling on packages and modulesTimely qualification and production launchesData analysis, dispositions, and associated reportsDevelopment and deployment of comprehensive design verification test capabilities that ensure compliance to spec.Work with the technology team to enhance and validate new technologies, device structures, and design rulesWork with the test development team to drive pre-production yield enhancements, reliability and test methodology improvementsProvide feedback into next generation product specifications and developmentQualifications and RequirementsDeep and thorough understanding of microsystem package design, characterization, qualification and reliability requirementsExperience with power module development through product manufacturing deploymentDemonstrated ability to drive thorough new package verification and validation proceduresDemonstrated sound DOE practicesDemonstrated ability to investigate, find root cause, and implement appropriate corrective actions using statistical data analysis methods across a broad range of disciplines including device physics, fabrication, test methods, product specifications and product reliabilityStrong working knowledge of statistical data analysis tools and scripting languagesWork directly and interactively with multidisciplinary engineering team and customers to define and implement effective package and module product solutionsAbility to design and simulate effective thermal solutions for productsBS, MS or PhD in mechanical engineering, physics, or electrical engineering with a minimum 5 years of experienceAbility to work in a multi-disciplinary team environmentWillingness to travel up to 10% of the timeMust be US person per ITAR regulationsDesired work location is Albany, NY Desired CharacteristicsExperience with advanced packaging technologiesExperience in aerospace and defense industryExperience with heat pipes, liquid cooling and other advanced thermal management technologies for power electronicsA critical problem solver and innovatorExpertise in SolidWorks softwareSubject matter expertise in CFD analysisExcellent communication skillsExperience with power package technologiesFamiliarity with power relays and protection devicesProvide mentorship to junior mechanical engineersExperience with AC and DC power systems at ratings up to 1kV and 1000AA working understanding of MEMS or semiconductor device design and fabrication.

Created: 2025-02-21