Senior Process Engineer - Wire bonding

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY22 and approximately 25,000 people globally working alongside 125,000 global customers, ADI ensures today's innovators stay Ahead of What's Possible.Analog Devices Federal LLC(ADFED), a wholly owned subsidiary of Analog Devices, Inc., is searching for a Senior Process Engineer to support the manufacture of complex hybrid microelectronics for commercial, space, and military applications. ADFED is in the process of expanding its manufacturing footprint and scaling production of multiple modules. The individual selected for this position will play a pivotal role in defining standard work that will be leveraged across the wire bonding manufacturing work cell. The selected candidate will be empowered to plan, perform, and report on projects targeted at improving delivery, quality, and cost metrics of production programs with minimal supervision, and at times will be asked to support in the development of other engineering team members. The nature of projects may require collaboration across the organization with different engineering functions, operations, quality, supply chain, and management to ensure goals are met. Wire bonding processes will be the primary focus area, but this individual may also be asked to support design, continuous improvement, and root-cause corrective action tasks among various other efforts.This is a hands-on position, supporting 1st shift manufacturing operations, that will require proficiency across a multitude of automated and manual pieces of equipment as well as the operations that utilize them. The process engineer will be responsible for establishing new processes, improving current process, and supporting the competency of operations and engineering staff across the following:Hand assemblyAutomated and manual wedge and ball bonding (F&K, Hesse, Westbond, etc.)Bond pull/shear testing and rework (Dage, XYZtec, Bondtec, etc.)Plasma and solvent cleaning technologies (Panasonic, March, etc.)The ideal candidate will have in-depth knowledge of microelectronics construction with a strong aptitude for automated and manual assembly equipment as well as the communication skills required to work with various team members. Additionally, you will serve as a trusted resource regarding applicable quality standards to support the disposition of discrepant material, release capable processes, and support design discussions. Strong statistical background and an understanding of the DMAIC process and tools is a must. This is a highly visible role that will require the qualified candidate to be adaptable, take initiative, and be a solid team player.Qualifications:Bachelor of Science in Engineering discipline or equivalent experienceMinimum of 4 years experience in electronics manufacturing, preferably wire bondingIn-depth understanding of MIL-STD-883, MIL-PRF-38534, and other associated standardsWorking knowledge of equipment used in wire bonding (Delvotek, Hesse, Dage, March, etc.)Good communication and interpersonal skillsAbility to follow both verbal and written instructions, interpret equipment manuals and process knowledge of Microsoft Office (Excel, PowerPoint, Word), statistical software(Minitab or JMP), and AutoCAD or related modeling software.Good hand-eye coordination for work under a microscope is necessaryLean Six Sigma Green/Black Belt certification preferredProject management experience preferredPrior experience working in a highly controlled medical or defense manufacturing area preferredU.S. Citizenship is requiredActive security clearance or a willingness to apply for a security clearance is required#LI-PG1For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position - except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) - may have to go through an export licensing review process.Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.EEO is the Law: Notice of Applicant Rights Under the Law.Job Req Type: Experienced Required Travel: No Shift Type: 1st Shift/Days Security Clearance required: Yes

Created: 2024-11-19