Packaging Engineer ll

Packaging Engineer ll Rochester Electronics is hiring immediately for Packaging Engineers! For the last 40 years, Rochester Electronics, in partnership with over 70 leading semiconductor manufacturers, has provided our valued customers with a continuous source of critical semiconductors. As an original manufacturer stocking distributor, Rochester has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world's most extensive range of end-of-life (EOL) and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester can manufacture over 70,000 device types. At Rochester Electronics, we create an excellent employee experience focused on value, performance, motivation, recognition, and career growth. Many companies say their employees are their most important asset. At Rochester Electronics, we mean it! Our benefits include but are not limited to the following: Outstanding low-cost medical, dental, vision, and prescription drug coverage, Rochester pays 92% of the premiums on behalf of its full-time employees Paid time off, including vacation, sick, and holiday 100% Rochester-funded Profit-Sharing program Two-tier Rochester match 401K program Tuition reimbursement Flexible spending account And so much more! Packaging Engineer General Summary The Packaging Engineer II is responsible for executing semiconductor packaging projects on future and existing product formats to support the manufacturing operations to ensure customer service, profitability, and continuous improvement. This role provides package design, materials development, and sustaining support for semiconductor assemblies. Packaging Engineer Responsibilities Manage and develop materials suppliers and processes for high-reliability applications. Establish material specifications and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Working knowledge in materials characterization and analysis. General understanding of assembly processes, IC packaging materials, reliability standards, and FA techniques. Provides consultation concerning packaging problems and improvements in the packaging process. Actively interact with Program Managers, Engineering, Quality, OSAT and suppliers to promptly provide robust and reliable components. Packaging Engineer Basic Qualifications Master's Degree or Bachelor's Degree in Packaging Engineering (preferred), Materials Engineering, Mechanical Engineering, Industrial Engineering, Manufacturing Engineering, or a related engineering field. Packaging Engineer Preferred Qualifications Analytical and problem-solving skills with the willingness to lead and work effectively with a team. Comprehensive understanding of multiple relevant packaging technologies (FC-BGA, large BGA, SiP, leadframe, and Hermetic packages) Reputation and track record for having a can-do attitude and a customer-first mindset. Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers. Ability to work independently and take on projects with minimum supervision. Good engineering problem-solving skills with strong engineering physics and fundamentals. Mentor junior-level employees on tool operation and best practice assembly techniques Rochester Electronics is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, genetics, disability status, age, veteran status, or other characteristics protected by applicable law. Rochester Electronics is committed to a culturally diverse workforce. Our company provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, sex, national origin, age, disability or genetics.

Created: 2024-11-02