Failure Analysis Technician

Job **The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.Skill sets required not limited to the **Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM/EDX on printed circuit board are preferred. Knowledge of packaging material property and behavior is beneficial.Candidate must also demonstrate good verbal and technical writing skills, work well with a team, deliver under pressure, and well organized.Minimum educational qualification is an AS degree in science or engineering and 2-4 years' experience in failure analysis, material analysis, process development or analytical tool development.

Created: 2025-02-24