Intellectual Property Associate - Patent Prosecution
Interlink Talent Solutions - Chicago, IL
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Our AM Law & Chambers ranked firm are seeking a Intellectual Property/Patent Prosecution Associate to join our team in the following offices: Chicago, Denver, Fort Wayne, Indianapolis, Minneapolis, Philadelphia, Washington DC, or Wilmington officesOur client often receives recognition in various legal rankings, such as those from Chambers and PartnersLegal 500, and U.S. News & World ReportKey Responsibilities:Candidates must be collaborative and motivated to succeed in a client-focused, team-oriented environment.Candidates must also have excellent academic credentials and have strong written and oral communications skills.This position offers competitive compensation and unlimited potential for professional growth.Current firm plans for returning to work include an average of 2-3 days in the office.Qualifications:1-3 years of experience drafting and prosecuting patent applications.A background and degree(s) in Electrical Engineering, Computer Engineering, Computer Science, or equivalent technical expertise will be considered.Having a degree in engineering is preferred.State bar admission and admission with the United States Patent and Trademark Office (USPTO) is required.Benefits: Benefits package for attorneys: productivity and discretionary bonuses; life, health, accident and disability insurance; and a 401(k) plan.Compensation: $160,000 - $255,000.If you are interested in this position, and you meet the requirements of the role, please click 'apply now' to forward an up-to-date copy of your resume, transcript and writing sample. Alternatively, if you would like to discuss this opportunity further, please contact Lauren Timoney for a confidential discussion.Our advertisements use salary and experience as a guide only. Interlink Recruitment is an equal opportunities employer. Please Note: Due to the high volume of applications we are currently receiving we are unable to contact applicants who have been unsuccessful.
Created: 2025-03-03