Sr. Principal Wafer Bonding Integration Engineer

We are working on behalf of a leading maker of RF ICs and RF Front End Modules for mobile, WIFI and other fast-growing markets. They also use SAW and BAW technology for RF Filters. They are looking for a Sr. Principal Wafer Bonding Integration EngineerAs the company adapts and improve its' SAW /BAW product, your responsibility will be to provide optimal solutions for Wafer Bonding needs, which ensure a successful transfer to high volume production.Will promote efficiency in the process, yields, and drive best practices. Will be a high-level technical contributor, as well as having dotted line management responsibility across several disciplines. We need an advanced degree in Electrical Engineering, Material Science, or Physics, with 10+ years in Semiconductor process and 8+ years in Wafer Bonding. Experience in with Piezo-electronics, or acoustic filters is preferred. Experience in RF or MEMs is useful as well.Should have proven success in Wafer Bonding in a high-volume manufacturing environment.

Created: 2025-02-09